The beginning
Reflow soldering is one of the most commonly used wiring processes in modern electronic manufacturing. In the production process of circuit boards, reflow soldering temperature is a crucial factor, which directly affects the reliability and service life of the circuit board. Therefore, choosing the appropriate reflux temperature is very important.
For most components and circuit boards, the recommended reflux temperature is usually at least 13 ° C higher than the melting point. Therefore, the peak temperature window of SAC305 alloy is 233 ° C -255 ° C. If this 13 degree criterion is applied to SnCuNi alloys, the minimum recommended peak temperature is 240 ° C.
A suitable reflux temperature can ensure the good performance of the solder joint. When selecting the reflux temperature, a comprehensive selection should be made based on factors such as the type of components on the circuit board, the appropriate range of welding temperature, and the usage environment. Generally speaking, high temperatures can make solder joints hard and brittle, reduce the heat resistance of circuit boards, and low temperatures may lead to poor contact, passivation, and other issues. Therefore, selecting an appropriate reflux temperature can avoid the occurrence of the aforementioned problems.
In short, reflow soldering technology plays a very important role in electronic production, and an appropriate reflow temperature can effectively ensure the good performance and service life of circuit boards. Therefore, we should pay attention to the selection of reflux temperature and comprehensively select the most suitable welding temperature according to different situations.
