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What problems should be paid attention to when using a reflow oven?

Jun 14, 2022



When using the temperature curve tester, the following points should be noted:


1) When measuring, a fully assembled plate must be used. First, the thermal characteristics of the printed board components are analyzed. Due to the different heating performance of the printed board, the size of the components and the difference in materials, the actual heating temperature of each point is different. Find the hottest and coldest points, and set the thermoelectric Even can measure the maximum temperature and minimum temperature.

2) Set as many thermocouple test points as possible to fully reflect the real heating state of each part of the printed board. For example, the center and edge of the printed board are not heated to the same degree, the thermal capacity of large-volume components and small components is different, and the thermal-sensitive components must be set to test points.


3) The thermocouple probe has a small shape and must be fixed at the test position with the specified high-temperature solder or adhesive, otherwise it will loosen due to heat and deviate from the predetermined test point, causing test errors.


In fact, when the reflow oven temperature curve and the temperature curve tester are used, there are large, medium and small models of reflow soldering on the market. Sixteen warm zone. The larger the reflow soldering temperature zone, the better the soldering effect, which should be determined according to the customer's product requirements.




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