Common sense of PCBA process
PCBA reflow process
1. Lead:
(1) PEAK temperature is 210-240 degrees.
(2) The preheating temperature is 130-170 degrees.
(3) The preheating time is 60-120 seconds.
(4) The time above 200 degrees is less than 30 seconds.
(5) The heating angle is within 3 degrees/second.
2. Lead-free:
(1) PEAK temperature is 235-245 degrees.
(2) The preheating temperature is 140-180 degrees.
(3) The preheating time is 60-120 seconds.
(4) The time above 200 degrees is less than 30 seconds.
(5) The heating angle is within 3 degrees/second.
(6) The cooling rate is 6-12 degrees per second below 200 degrees.
3. Red glue:
(1) PEAK temperature: 135 degrees -150 degrees.
(2) Constant temperature time: 90 seconds to 120 seconds. PCBA wave soldering furnace process
1. Lead:
(1) Preheating temperature: 80 degrees -100 degrees.
(2) Preheating time: 30-60 seconds.
(3) PEAK temperature: 220-240 degrees.
(4) DIP time 3-5 seconds.
(5) Temperature drop T: less than 60 degrees.
2. Lead-free:
(1) Preheating temperature: 100 degrees -120 degrees.
(2) Preheating time: 40-80 seconds.
(3) PEAK temperature: 250 degrees plus or minus 10 degrees.
(4) DIP time 3-5 seconds.
(5) Temperature drop T: less than 60 degrees.
(6) Cooling rate (below 217 degrees): 6-12 degrees per second.
DTA lead-free solder wire composition content:
SN: 96.5%
AG: 3.0% CU: 0.5%
Flux: 2.0%
Lead-free soldering iron welding temperature: 360 degrees plus or minus 15 degrees.
