The infiltration angle between the fillet weld and the pad caused by the poor contact angle of the solder joint is greater than 90°.
2. Upright: One end of the component leaves the pad and is inclined upward or upright.
3. Short circuit: The solder between two or more solder joints that should not be connected is connected, or the solder of the solder joint is connected with adjacent wires.
4. Empty soldering: that is, the component lead and the PCB solder joint are not connected by solder.
5. False soldering: The component lead and the PCB solder joint seem to be connected, but they are not actually connected.
6. Cold welding: The solder paste at the solder joint is not completely melted or a metal alloy is not formed.
7. Less tin: The tin area or height of the component pins does not meet the requirements.
8. More tin: The tin area or height of the component pins exceeds the requirements.
9. Blackening of solder joints: The solder joints are black and dull. 10. Oxidation: The surfaces of components, circuits, PCBs or solder joints have undergone chemical reactions and have colored oxides.
11. Shift: The component deviates from a predetermined position in the lateral (horizontal), longitudinal (vertical) or rotational direction in the plane of the pad (based on the centerline of the component and the centerline of the pad).
12. Reverse polarity (reverse): The direction or polarity of the polarized components does not conform to the requirements of the documents (BOM, ECN, component location diagram, etc.)
13. Floating height: There is a gap or height between the component and the PCB.
14. Wrong parts: The specifications, models, parameters, shapes and other requirements of the components are inconsistent with (BOM, samples, customer information, etc.).
15. Tin tip: The solder joints of the components are not smooth, and there is a sharp tip condition.
16. Multiple pieces: According to BOM, ECN or template, etc., there are multiple pieces in the position where parts should not be mounted or if there are redundant parts on the PCB.
17. Missing parts: According to the BOM, ECN or template, etc., the position of the parts that should be mounted or the parts on the PCB but not the parts are all less parts.
18. Dislocation: The position of the component or component feet is moved to the position of other PCBs or feet.
19. Open circuit: The PCB circuit is disconnected.
20. Lay on the side: the sheet-like components with different widths and heights are placed on the side.
21. Inverse: The two symmetrical faces of the components have different positions, and chip resistors are common.
22. Tin beads: small tin spots between component feet or outside the PCB.
23. Air bubbles: There are air bubbles inside solder joints, components or PCBs.
24. Climbing tin: The height of solder joints of components exceeds the required height.
25. Tin crack: The solder joint is cracked.
26. Hole plugs: PCB plug-in holes or vias are blocked by solder or other.
27. Damage: There are cracks, cuts, or damage to components, bottoms, surfaces, copper foils, circuits, through holes, etc.
28. Blurred screen printing: The text or screen printing of components or PCBs is blurred or broken, which cannot be recognized or blurred.
29. Dirty: The board surface is not clean, and there are foreign objects or stains.
30. Scratches: scratches on PCB or buttons and exposed copper foil.
31. Deformation: Components or PCB bodies or corners are not on the same plane or bent.
32. Blistering: PCB or components are layered with copper and platinum, and there is a gap.
33. Spilled glue: the amount of red glue is too much or overflows the required range.
34. Less glue: The amount of red glue is too small or does not meet the required range.
35. Pinholes: PCBs, PCBs, solder joints, etc. have pinhole concave points.
36. Burr: The edge or burr of the PCB board exceeds the required range or length.
37. Gold finger impurities: There are abnormalities such as pitting, tin spots or solder mask oil on the surface of the gold finger plating.
38. Gold finger scratches: There are scratches or exposed copper and platinum on the surface of the gold finger plating.
