What is a vacuum reflow oven:
Vacuum reflow oven is to perform high-quality soldering on products in a vacuum environment. Under vacuum conditions, it is used to protect the products and solder from being oxidized, and at the same time, the oxides on the surface of the product and the solder are reacted, so that the quality of the soldering surface is improved and reduced. The void ratio of soldering is reduced. Generally used in aerospace, medical, automotive and other high-precision products.
The role of vacuum reflow oven:
1. Significantly reduce voids in solder
* The void area of organic combination with solder can reach below 1%
* Improve the electrical characteristics and bonding performance of the product
2. Up and down hot air circulation heating method
* Double-sided solder can also be vacuum reflowed once, which can greatly reduce voids
* Can be welded to circuit boards with aluminum heat sinks installed
3. Ultra-low power consumption and high thermal insulation design based on the concept of environmental protection (saving 40% of energy)
Our factory currently uses ETC vacuum reflow oven and HELLER air reflow oven, which can make finer pcb boards for customers.
