SMT is a surface mount technology and a complex industry technology. The placement machine is one of the most critical equipment in the SMT production line. The placement machine is a combination of machine-electric-optical and computer control system technologies. Place the required components on the designated pad positions on the circuit board by moving the placement head.
The placement head is an intelligent manipulator, which also becomes a cantilever in the placement machine. A placement head has multiple suction nozzles to pick up the required components and place them on the circuit board pads with precise displacement. Component pick-up generally uses a suction nozzle with vacuum negative pressure, and the component is sucked by the suction nozzle. When the suction nozzle moves, it should not only pick up fast, but also be stable and accurate. The suction nozzle is recognized by the motor and camera loaded on the placement head. The control system is responsible for absorbing the specified components through programming.
The suction nozzle directly absorbs SMD components through vacuum negative pressure. The shape and size of the suction nozzle should be consistent with the shape of the smd component. Different types of suction nozzles absorb different material components. The suction nozzles are also divided into tungsten steel suction nozzles and plastic suction nozzles. Nozzles, ceramic nozzles, and nozzles need to be regularly maintained and maintained to avoid high throwing rates due to poor suction.
The automatic placement machine completes the patch processing and production through the cooperation of various components, and mounts various types and sizes of SMDs to the designated pad positions of the circuit board. Rapid development and rapid performance improvement.
