Chips have been widely used in all walks of life. Among various packaging methods, BGA has the characteristics of small packaging area, increased functions, increased number of pins, high reliability, good electrical performance, and low overall cost. For example, the north and south bridges of the computer motherboard are packaged BGA, and the LCD TV motherboard also uses BGA chips.
The full name of BGA is Ball Grid Array (PCB with ball grid array structure), which is a pin packaging method for large components. The difference is that the "one-degree space" single-row pins listed around, such as gull-wing extension feet, flat extension feet, or J-shaped feet retracted to the abdominal bottom, etc.; The distribution of solder balls with two-dimensional space area is adopted as a welding and interconnection tool for the chip package to the circuit board.
BGA rework station, as the name suggests, is a machine used to rework BGA. The BGA rework station is a device for reheating and soldering the BGA with poor soldering. Laptops, mobile phones, XBOX, desktop motherboards, will use BGA rework station to repair.
Using a BGA rework station can be roughly divided into three steps: desoldering, mounting, and soldering.
Desoldering
1. For the BGA chip to be repaired, select the air nozzle to be used. Fix the PCB main board on the BGA rework station, locate the laser red dot at the center of the BGA chip, shake the mounting head down, and determine the mounting height.
2. Set the desoldering temperature and store it so that it can be called directly during repair. Switch to the removal mode, click the repair button, and the heating head will automatically heat the BGA chip. After the temperature curve is completed, the suction nozzle will automatically pick up the BGA chip, and when it rises to the initial position, the operator can use the material box to connect the BGA chip. At this point, desoldering is complete.
mount
1. After the tin removal on the pad is completed, use a new BGA chip or a ball-mounted BGA chip. Fix the PCB motherboard. Place the BGA to be soldered roughly where the pads will be.
2. Switch to the placement mode, the placement head will automatically move down, and the suction nozzle will pick up the BGA chip to the initial position.
welding
1. Open the optical alignment lens, adjust the micrometer, adjust the front, rear, left, right, and right of the PCB board on the X axis and the Y axis, and adjust the angle of the BGA by the R angle. The solder balls (blue) on the BGA and the solder joints (yellow) on the pads can be displayed in different colors on the display. After adjusting the solder balls and the solder joints to be completely coincident, click the "Alignment Completion" button.
2. The placement head will automatically drop and place the BGA on the pad, and then heat it. After the temperature line is completed, the heating head will rise to the initial position and the welding is completed.
Some people believe that packaging chips is a craft and requires a high level of technology to ensure the success rate of chip rework. However, a BGA rework station with high precision, precision and simple operation can allow a layman to win easily in chip packaging.
