Usually we analyze the factors affecting the process quality from four levels: design factors, process factors, material factors and field factors, as follows:
Design Factors
1. Assembly method (process flow)
2. Component packaging
3. Component layout and density design
4. Solder joint reliability and manufacturability design
5.PCB structure, material and process design
Process factors
1. Steel mesh design problems
2. Printing parameter problem
3. Soldering problems such as reflow/wave soldering
4.smt/THT problem
5. Others
Material factors
1. BOM correctness
2. Process quality of components
3. PCB process quality
4. Storage and distribution management
5. Others
On-site factors
1. Operational normative
2. Process control
3.ESD management
4. Temperature/humidity control
5.SS etc.
PCBA design elements include: process route, PCB stack-up, PCB size, structure/panel/process edge requirements, reference point requirements, component layout requirements, wiring requirements, reflow soldering/wave soldering/hand soldering requirements, crimping requirements, Insertion requirements, aperture design requirements, solder mask design requirements, surface treatment requirements, test requirements, silk screen design requirements, product feature requirements, output process document requirements and other special design requirements.
