Since the development of the PCBA industry, some common terms in the industry are also widely circulated. As a beginner, you must have some understanding of the special terms in the electronic processing industry. Here are some common terms in the PCBA industry.
1. Soldering terminal: metallized electrode of leadless chip component.
2. Chip Component: Generic term for any leadless surface mount passive device with two terminals. For example, resistors, capacitors, inductors, etc.
3. Mil: the imperial measurement unit of length, 1mil = 0.001inch (inch) = 0.0254 mm (mm), unless otherwise specified, the conversion between the imperial unit and the national standard unit used in this article is 1mil=0.0254mm.
4. Printed circuit board PCB: a general term for a circuit board that has been processed by a printed circuit or a printed circuit process. Including hard board, flex board, single-sided, double-sided and multi-layer boards.
5. Pad pad: On the mounting surface of the patch component of the PCB circuit board, it is used as a conductor pattern for interconnecting components on the surface of the corresponding position.
6. Package: The component assembly pattern composed of surface silk screen and multiple pads is made on the PCB circuit board according to the pin specifications and actual dimensions of electronic components.
7. Wave soldering: The printed circuit board with pre-installed components is soldered in one direction through a stable, continuous wave of molten solder.
8. Reflow soldering: Reflow soldering, also known as reflow soldering, is a soldering process in which surface mount components and PCB pads are reliably combined through solder paste alloy by providing a heating environment to melt solder paste. At present, most of the popular and practical ones are full hot air reflow soldering, infrared heated air reflow soldering and far infrared reflow soldering.
9. Lead spacing: refers to the center distance of adjacent leads.
10. Integrated circuit IC: It interconnects various electronic components and wiring required for a functional circuit, integrates it on a small semiconductor wafer, and finally encapsulates it in a tube case to become a chip with specific functions.
11. Ball grid array package device BGA: An integrated circuit device in which the leads of the device are arranged in the shape of a ball fence on the bottom surface of the package.
12. Meniscus: refers to the meniscus coating formed between the component leads and the potting or molding material package. Encapsulation materials include ceramics, epoxy materials or other synthetic compounds and cover materials for molded devices.
